200mm Polished Silicon Wafers (Available 2026)
- Diameter: 200mm (8 inch)
- Thickness: 725 ± 25 µm
- Type: P-type / N-type
- Orientation: <100> / <111>
- Resistivity: 1 – 100 ohm·cm
- Grade: Prime & Test
- Application: MEMS, Analog, Power Devices, R&D
Custom specifications and wafer flats/notches available on request
300mm Polished Silicon Wafers (Available 2026)
- Diameter: 300mm (12 inch)
- Thickness: 775 ± 25 µm
- Type: P-type / N-type
- Orientation: <100> / <111>
- Resistivity: 1 – 100 ohm·cm
- Grade: Prime & Test
- Application: Advanced Logic, Power ICs, Packaging Substrates
In Development
Silicon-On-Insulator (SOI) Wafers
- Roadmap for 2028
- Custom BOX and device layer specs
- Focus: MEMS, RF, and Photonics
Epitaxial Wafers
- Roadmap for 2028
- Application: High-voltage & high-frequency devices
- Capability: Lightly & heavily doped epi layers
Specialty Wafers
- Dummy/Test Wafers (FZ/CZ)
- Laser marking & edge chamfering
- Mirror-polished for metrology
- Available in single- or double-side polish (SSP/DSP)
Packaging & Cleanroom Handling
All wafers are processed and packaged in ISO Class 5 cleanroom environments using certified carriers and vacuum-sealed wafer cassettes. CoA and QC reports included in every shipment.
Custom Orders & Collaboration
If you have specialized needs — whether for process development, defense-grade materials, or compound semiconductor substrates — our team can co-develop customized wafer specs in collaboration with your engineers.
✉ Contact Us to request technical datasheets or schedule a discussion.